Special Session VI: Circuit Systems, RF Signals, and Information Security 电路系统、射频信号与信息安全
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| Session Chair: Prof. Hongxin Zhang, Beijing University of Posts and Telecommunications, China | Co-Chair: Assoc. Researcher Shaofei Sun, Beijing University of Posts and Telecommunications, China |
Summary:
This special session focuses on Circuits, Radio Frequency (RF) and Electromagnetic Security, Signals and Systems, Side-Channel Analysis, and Electronic Information. It aims to explore key technologies for integrated design and protection from the hardware level to application systems. Circuit design covers analog, digital, and mixed-signal integrated circuits, laying the foundation for chips. RF and antenna technologies, along with electromagnetic security, address wireless transmission, electromagnetic interference and compatibility, as well as electromagnetic pulse protection, ensuring device reliability in complex electromagnetic environments. Signals and Systems provide time-frequency domain analysis tools to support modulation, filtering, and signal detection. Side-Channel Analysis concentrates on cryptographic attacks and defense strategies via physical leakage such as power consumption, timing, and electromagnetic radiation. Electronic Information integrates the above technologies for applications in communications, radar, navigation, intelligent computing, and more. These directions are deeply intertwined, collaboratively driving full-stack innovation in high-performance and high-security electronic systems, representing a critical frontier in current information technology development.
本专题围绕电路、射频与电磁安全、信号与系统、侧信道分析及电子信息展开，旨在探讨从硬件底层到应用系统的一体化设计与防护关键技术。电路设计涵盖模拟、数字及混合集成电路，奠定芯片基础；射频与天线、电磁安全关注无线传输、电磁干扰与兼容性，以及电磁脉冲防护，确保设备在复杂电磁环境中的可靠性；信号与系统提供时频域分析工具，支撑调制、滤波与信号检测；侧信道分析聚焦于通过功耗、时序、电磁辐射等物理泄露实施密码攻击及防御策略。电子信息则集成上述技术，面向通信、雷达、导航、智能计算等应用场景。各方向深度交叉，协同推动高性能、高安全电子系统的全栈创新，是当前信息科技发展的关键前沿领域。
Topics of interest include, but are not limited to:
Topic 1: RF, Antenna, and Mixed-Signal Circuit Design （射频、天线与混合信号电路设计）
Topic 2: Digital Integrated Circuits, Systems, and Design Automation （数字集成电路、系统与设计自动化）
Topic 3: Electromagnetic Compatibility, Signal Integrity, and Power Integrity （电磁兼容、信号完整性与电源完整性）
Topic 4: Signal Processing, Communications, and Information Systems （信号处理、通信与信息系统）
Topic 5: Side-Channel Analysis and Software/Hardware Security （侧信道分析与软、硬件安全）
Topic 6: Emerging Technologies and Applications in Electronic Information （电子信息前沿技术与应用）
Keywords:
Circuits and Systems （电路系统）
RF and Microwave （射频微波）
Electromagnetic Compatibility (EMC) （电磁兼容）
Side-Channel Analysis （侧信道分析）
Signals and Systems （信号与系统）
Electronic Information （电子信息）
Antennas （天线）
Computers and Chips （计算机与芯片）
Submission Deadline: September 15, 2026