Welcome to 2024 4th International Symposium on Electrical, Electronics and Information Engineering (ISEEIE 2024), which will be held in Hangzhou, China on June 28-30, 2024.

The conference endeavored to facilitate collaboration and spark innovation in Electrical, Electronics, and Information Engineering research and development. Electrical and electronics engineering from strength production via electrical equipment to wireless communication and robots has a major effect on societal development. This improvement calls for greatly skilled engineers with specialized know-how in one of the many disciplines of electrical engineering. The modern society relies on the work of Information engineers who develop and design the processes that make the useful products for the society by efficient use and management of information. Topics of interests of this conference cover all theoretical and practical aspects, but not limited to Electrical and Electronics Engineering, Communications and Computer Systems, Automation and Control Engineering, Informatics and Computer Sciences, and Information Engineering.

2024 4th International Symposium on Electrical, Electronics and Information Engineering (ISEEIE 2024) aims to bring together Electrical Engineers, Electronics Engineers, and Information Engineers in a single platform and present their stimulating research and knowledge transfer ideas in the Electrical, Electronics and Information Engineering. Therefore, we encourage the participation of other disciplines in this conference where multidisciplinary research and knowledge transfer projects are presented.

Finally, we do hope all of you will have enjoyable and valuable experience during this conference event. Please share your best knowledge in your area of research and professional activities. We look forward to welcoming you in ISEEIE 2024.

Professor Yigang He

On Behalf of ISEEIE 2024 Organizing Committee

Wuhan University, China

ISEEIE 2024 conference proceedings will be published as Digital Conference Proceedings. All accepted and presented full papers will be submitted to major citation databases like Ei Compendex, SCOPUS, Google Scholar for reviewing and indexing.

Excellent papers can be recommended to be published in Special Issue "Micro-Nano Sensors and the Internet of Things for Intelligent Energy" in Sensors (ISSN 1424-8220, IF=3.847), and will be sent to be indexed by SCIE, Ei Compendex, SCOPUS, Inspec, DOAJ, and CNKI etc.

Excellent Papers with significant extension will be recommended to be submitted for publication in Journal "Energies" which will send to be reviewed and indexed by major citation databases such as Ei, SCIE and Scopus.

Excellent Papers can be recommended to be submitted for publication in Special Issue "Micro-Nano Sensors and the Internet of Things for Intelligent Energy" in Sensors (ISSN 1424-8220, IF=3.847), which will be submitted to CNKI, El, Scopus, SCIE and etc. for indexing.

NEWS

[2023-01-06] 2023 3rd International Symposium on Electrical, Electronics and Information Engineering has been held successfully on June 30, 2023-July 2, 2023. 

[2023-01-06] We are glad to invite Prof. Jagannathan Sarangapani(IEEE Fellow, IET Fellow) from Missouri University of Science and Technology, USA to give us a keynote speech.

[2023-01-03] Prof. Trung Q. Duong from Queen's University Belfast, UK will give us a keynote speech. He is a Fellow of IEEE and AAIA.

[2022-09-02] Organized by Nipissing University and Beijing University Of Technology, 2023 3rd International Symposium on Electrical, Electronics and Information Engineering (ISEEIE 2023) will be held in Hangzhou, China on June 2-4, 2023.

2022 International Symposium on Electrical, Electronics and Information Engineering (ISEEIE 2022) has been published by Conference Publishing Services (CPS), and index by EI Compendex and Scopus. Proceeding link: https://ieeexplore.ieee.org/xpl/conhome/9853250/proceeding

2021 International Symposium on Electrical, Electronics and Information Engineering (ISEEIE 2021) has been published in ACM Conference series and index by EI Compendex and Scopus. Proceeding link: https://dl.acm.org/doi/proceedings/10.1145/3459104