Welcome to 2023 3rd International Symposium on Electrical, Electronics and Information Engineering (ISEEIE 2023), which will be held in Hangzhou, China on June 2-4, 2023.
Organized by Nipissing University and Beijing University Of Technology, the conference endeavored to facilitate collaboration and spark innovation in Electrical, Electronics, and Information Engineering research and development. Electrical and electronics engineering from strength production via electrical equipment to wireless communication and robots has a major effect on societal development. This improvement calls for greatly skilled engineers with specialized know-how in one of the many disciplines of electrical engineering. The modern society relies on the work of Information engineers who develop and design the processes that make the useful products for the society by efficient use and management of information. Topics of interests of this conference cover all theoretical and practical aspects, but not limited to Electrical and Electronics Engineering, Communications and Computer Systems, Automation and Control Engineering, Informatics and Computer Sciences, and Information Engineering.
2023 3rd International Symposium on Electrical, Electronics and Information Engineering (ISEEIE 2023) aims to bring together Electrical Engineers, Electronics Engineers, and Information Engineers in a single platform and present their stimulating research and knowledge transfer ideas in the Electrical, Electronics and Information Engineering. However, we also recognize that the future for engineers is one where they will be working in interdisciplinary teams to solve new, complex, and evolving problems that will require innovative solutions. Therefore, we encourage the participation of other disciplines in this conference where multidisciplinary research and knowledge transfer projects are presented.
Finally, we do hope all of you will have enjoyable and valuable experience during this conference event. Please share your best knowledge in your area of research and professional activities. We look forward to welcoming you in ISEEIE 2023.
Professor Haibin Zhu
On Behalf of ISEEIE 2023 Organizing Committee
Nipissing University, Canada
ISEEIE 2023 conference proceedings will be published as Digital Conference Proceedings. All accepted and presented full papers will be submitted to major citation databases like Ei Compendex, SCOPUS, Google Scholar for reviewing and indexing.
Selected papers can be recommended to be published in Special Issue "Micro-Nano Sensors and the Internet of Things for Intelligent Energy" in Sensors (ISSN 1424-8220, IF=3.847), and will be sent to be indexed by SCIE, Ei Compendex, SCOPUS, Inspec, DOAJ, and CNKI etc.
Selected Papers with significant extension will be recommended to be submitted for publication in Journal "Energies" which will send to be reviewed and indexed by major citation databases such as Ei, SCIE and Scopus.
Selected papers will be considered for submission in following journal after significant extension.
------Mathematics
------Frontiers in Mechanical Engineering
------Processes
NEWS
[2023-01-06] We are glad to invite Prof. Jagannathan Sarangapani(IEEE Fellow, IET Fellow) from Missouri University of Science and Technology, USA to give us a keynote speech.
[2023-01-03] Prof. Trung Q. Duong from Queen's University Belfast, UK will give us a keynote speech. He is a Fellow of IEEE and AAIA.
[2022-09-02] Organized by Nipissing University and Beijing University Of Technology, 2023 3rd International Symposium on Electrical, Electronics and Information Engineering (ISEEIE 2023) will be held in Hangzhou, China on June 2-4, 2023.
2022 International Symposium on Electrical, Electronics and Information Engineering (ISEEIE 2022) has been published by Conference Publishing Services (CPS), and index by EI Compendex and Scopus. Proceeding link: https://ieeexplore.ieee.org/xpl/conhome/9853250/proceeding
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2021 International Symposium on Electrical, Electronics and Information Engineering (ISEEIE 2021) has been published in ACM Conference series and index by EI Compendex and Scopus. Proceeding link: https://dl.acm.org/doi/proceedings/10.1145/3459104
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